TS68302VR1BSLASHT16 datasheet(8/47 Pages) ATMEL

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TS68302

2117A–HIREL–11/02

This device contains protective circuitry to protect the inputs against damage due to high

static voltages or electrical fields; however, it is advised that normal precautions be

taken to avoid application of any voltages higher than maximum-rated voltages to this

high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to

an appropriate logic voltage level (e.g., either GND or V

DD).

Figure 5. Clock Input Timing Diagram

Note:

Timing measurements are referenced to and from a low voltage of 0.8V and a voltage of 2.0V, unless otherwise noted. The volt-

age swing through this range should start outside, and pass through, the range such that the rise or fall will be linear between

0.8V and 2.0V.

Power Considerations

The average chip-junction temperature, TJ, in °C can be obtained from:

TJ = TA + (PD ⋅ θJA)

(1)

TA = Ambient Temperature, °C

JA = Package Thermal Resistance, Junction-to-Ambient, °C/W

PD = PINT + PI/O

PINT = ICC ⋅ VCC, Watts - Chip Internal Power

PI/O = Power Dissipation on Input and Output pins - user determined

Note:

For T

A = 70°C and PD = 0.5 W at 12.5 MHz Tj = 88°C.

For most applications P

I/O < 0,30 PINT and can be neglected.

An approximate relationship between P

D and TJ (if PI/O is neglected) is:

D = K ÷ (TJ + 273)

(2)

Solving equations (1) and (2) for K gives:

K = P

D ⋅ (TA + 273) + θJA ⋅ PD2

(3)

where K is a constant pertaining to the particular part. K can be determined from equa-

tion (3) by measuring P

D (at equilibrium) for a known TA. Using this value of K, the

values of P

D and TJ can be obtained by solving equations (1) and (2) iteratively for any

value of T

2.0V

0.8V

tr (C)

tf (C)

tcyc

Table 4. Thermal Characteristics at 25°C

Package

Symbol

Parameter

Value

Unit

PGA 132

Thermal Resistance - Ceramic Junction To Ambient

Thermal Resistance - Ceramic Junction To Case

°C/W

CERQUAD 132

Thermal Resistance - Ceramic Junction To Ambient

Thermal Resistance - Ceramic Junction To Case

°C/W

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