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PRIXP425BD Scheda tecnica(PDF) 42 Page - Intel Corporation

Il numero della parte PRIXP425BD
Spiegazioni elettronici  Intel짰 IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
PDF  112 Pages
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Produttore elettronici  INTEL [Intel Corporation]
Homepage  http://www.intel.com
Logo INTEL - Intel Corporation

PRIXP425BD Scheda tecnica(HTML) 42 Page - Intel Corporation

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Intel® IXP42X Product Line and IXC1100 Control Plane Processor
Package and Pinout Information
42
Datasheet
4.0
Package and Pinout Information
The Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
have a 492-ball, plastic ball grid array (PBGA) package for commercial-temperature applications
and a pin-for-pin, compatible 492-ball, plastic ball grid array with a drop-in heat spreader (H) for
extended-temperature applications.
4.1
Package Description
Figure 6.
492-Pin Lead PBGA Package
1. All measurements are in millimeters (mm).
2. The size of the land pad at the interposer side (1) is 0.81 mm.
3. The size of the solder resist at the interposer side (2) is 0.66 mm.
B1268-03
0.60 ± 0.10
Seating Plane
30º
3
1.17 ± 0.05
2.38 ± 0.21
0.61 ± 0.06
0.15
C
0.20
-C-
SIDE VIEW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
AA
Y
W
U
T
23
22
21
20
19
18
17
16
24
25
26
V
AB
AC
AD
AE
AF
Pin #1
Corner
1.27
1.63 REF
1.27
A
C
ø 0.30
B S
ø1.0
3 Places
2
+ +
1.63 REF
0.90
0.60
ø
S
S
+
+
+
22.00 REF
22.00 REF
35.00 ± 0.20
35.00 ± 0.20
30.00 ± 0.25
Pin 1 ID
30.00 ± 0.25
45º Chamfer
4 Places
0.127 A
-B-
-A-
TOP VIEW
(1)
(2)



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