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AD7989-1BCPZ-R2 Scheda tecnica(PDF) 22 Page - List of Unclassifed Manufacturers |
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AD7989-1BCPZ-R2 Scheda tecnica(HTML) 22 Page - List of Unclassifed Manufacturers |
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22 / 24 page ![]() AD7989-1/AD7989-5 Data Sheet Rev. 0 | Page 22 of 24 OUTLINE DIMENSIONS Figure 41. 10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters Figure 42. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD] 3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-10-9) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-187-BA 6° 0° 0.70 0.55 0.40 5 10 1 6 0.50 BSC 0.30 0.15 1.10 MAX 3.10 3.00 2.90 COPLANARITY 0.10 0.23 0.13 3.10 3.00 2.90 5.15 4.90 4.65 PIN 1 IDENTIFIER 15° MAX 0.95 0.85 0.75 0.15 0.05 2.48 2.38 2.23 0.50 0.40 0.30 10 1 6 5 0.30 0.25 0.20 PIN 1 INDEX AREA SEATING PLANE 0.80 0.75 0.70 1.74 1.64 1.49 0.20 REF 0.05 MAX 0.02 NOM 0.50 BSC EXPOSED PAD 3.10 3.00 SQ 2.90 PIN 1 INDICATOR (R 0.15) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COPLANARITY 0.08 TOP VIEW BOTTOM VIEW 0.20 MIN |
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