OPA2835IDGS datasheet(2/53 Pages) NSC

2 / 53 page

OPA835

OPA2835

SLOS713E – JANUARY 2011 – REVISED JULY 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGING/ORDERING INFORMATION(1)

CHANNEL

PACKAGE –

PACKAGE

PRODUCT

COUNT

LEAD

DESIGNATOR

OPA835

SOT23-6

DBV

WQFN-10

RUN

OPA2835

SOIC-8

VSSOP-10

DGS

WQFN-10

RUN

UQFN-10

RMC

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

UNITS

VS– to VS+

Supply voltage

5.5

Input voltage

VS– - 0.7V to VS+ + 0.7V

VID

Differential input voltage

1 V

Continuous input current

0.85 mA

Continuous output current

60 mA

Continuous power dissipation

See Thermal Characteristics Specification

Maximum junction temperature

150°C

Operating free-air temperature range

–40°C to 125°C

Tstg

Storage temperature range

–65°C to 150°C

HBM

6 kV

ESD ratings

CDM

1 kV

200 V

THERMAL INFORMATION

OPA835

OPA2835

VSSOP

THERMAL METRIC(1)

SOT23-6

WQFN-10

SOT23-6

(MSOP) - 10

WQFN-10

UQFN-10

UNITS

(DBV)

(RUN)

(D)

(DGS)

(RUN)

(RMC)

6 PINS

10 PINS

8 PINS

10 PINS

θJA

Junction-to-ambient thermal resistance

194

145.8

150.1

206

145.8

143.2

θJCtop

Junction-to-case (top) thermal resistance

129.2

75.1

83.8

75.3

75.1

49.0

θJB

Junction-to-board thermal resistance

39.4

38.9

68.4

96.2

38.9

61.9

°C/W

ψJT

Junction-to-top characterization parameter

25.6

13.5

33.0

12.9

13.5

3.3

ψJB

Junction-to-board characterization parameter

38.9

104.5

67.9

94.6

104.5

61.9

θJCbot

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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