CS464 datasheet(4/4 Pages) CHERRY

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Package Specification

.525

± .05

.0302 MAX

13X .095

± .045

13X .165

± .038

1.022

.496

2.39

.356

.431

1.021

1.020

1.022

.279

.382

1.017

2.14

CS-464

ÊFlip-ChipÊ

OUT

VCC

Gnd

IN-

IN+

Test

Note: All dimensions in millimeters.

Flip-Chip

Rev. 3/1/99

PACKAGE DIMENSIONS IN mm (INCHES)

Ordering Information

Part Number

Description

CS464

Flip-Chip

CS464YDW16

16 Lead SO Wide

CS464YDWR16

16 Lead SO Wide (tape & reel)

PACKAGE THERMAL DATA

Lead Count

Metric

English

Max

Min

Max

Min

16 Lead SO Wide

10.50

10.10

.413

.398

Thermal Data

16 Lead SO Wide

RQJC

typ

ûC/W

RQJA

typ

105

ûC/W

Bump Locations, Bump Side Up

Cherry Semiconductor Corporation reserves the right to

make changes to the specifications without notice. Please

contact Cherry Semiconductor Corporation for the latest

available information.

Surface Mount Wide Body (DW); 300 mil wide

1.27 (.050) BSC

7.60 (.299)

7.40 (.291)

10.65 (.419)

10.00 (.394)

0.32 (.013)

0.23 (.009)

1.27 (.050)

0.40 (.016)

REF: JEDEC MS-013

2.49 (.098)

2.24 (.088)

0.51 (.020)

0.33 (.013)

2.65 (.104)

2.35 (.093)

0.30 (.012)

0.10 (.004)

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