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CS8221YDF8 Scheda tecnica(PDF) 5 Page - Cherry Semiconductor Corporation |
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CS8221YDF8 Scheda tecnica(HTML) 5 Page - Cherry Semiconductor Corporation |
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5 / 6 page ![]() 5 Thermal Data 8 Lead 3 Lead SO Narrow D2PAK (internally fused leads) RQJC typ 25 4.2 ûC/W RQJA typ 110 10-50* ûC/W *Depending on thermal properties of substrate. RQJA = RQJC + RQCA D Lead Count Metric English Max Min Max Min 8L SO Narrow 5.00 4.80 .197 .189 (internally fused leads) Package Specification PACKAGE DIMENSIONS IN mm (INCHES) PACKAGE THERMAL DATA Surface Mount Narrow Body (D); 150 mil wide 1.27 (.050) BSC 0.51 (.020) 0.33 (.013) 6.20 (.244) 5.80 (.228) 4.00 (.157) 3.80 (.150) 1.57 (.062) 1.37 (.054) D 0.25 (0.10) 0.10 (.004) 1.75 (.069) MAX 1.27 (.050) 0.40 (.016) REF: JEDEC MS-012 0.25 (.010) 0.19 (.008) |
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