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TS112 Scheda tecnica(PDF) 6 Page - Clare, Inc. |
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TS112 Scheda tecnica(HTML) 6 Page - Clare, Inc. |
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6 / 7 page ![]() www.clare.com 6 TS112 Rev. 1 Dimensions mm (inches) Mechanical Dimensions PC Board Pattern (Top View) 2.540 ± .127 (.100 ± .005) 5.080 ± .127 (.200 ± .005) 1.193 (.047) .787 (.031) .20 ± .025 (.008 ± .001) 2.54 TYP. (.100 TYP.) 2.18 MAX. (.086) 1.01 ± .025 (.040 ± .001) 3.81 ± .05 (.150 ± .002) 6.09 ± .10 (.240 ± .004) .38 x 45 ° (.015 x 45 °) .38 TYP. (.015 TYP.) 9.34 ± .20 (.368 ± .008) 8 Pin SOIC Narrow (“N” Suffix) 7.49 (.295) 2.00 (.079) 12.09 (.476) 1.75 (.069) 3.99 (.157) 1.50 (.059) 6.73 (.265) .41 (.016) 2.30 (.091) 2.70 (.106) Top Cover Tape 2.01 (.079) 11.99 (.472) User Direction of Feed .05R TYP. 16.00 (.630) 10.30 (.406) Embossment Embossed Carrier Top Cover Tape Thickness .10 MAX. (.004) 6.80 (.268) 6.50 (.256) 3.00 (.118) 1.55 ± .102 (.061 ± .004) 330.2 DIA. (13.00) Tape and Reel Packaging for 8 and 16 Pin Narrow SOIC Package 1 |
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