2

NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

Case

Diameter

RS

T

10.5

5.0

4.6

2.5

16.0

5.0

10.0

2.5

21.0

10.0

10.5

3.5

LAND PATTERN DIMENSIONS (mm)

T

R

S

S

COMPONENT OUTLINE

STANDARD RECOMMENDED REFLOW PROFILE

Peak Temperature

(235°C for 10 sec.)

50

100

150

200

250

Time

Pre-heat

160°C 120 sec. max.

25

0

Cool Down

Time above 200°C

30 sec. max.

V-Chip Memory Back-Up Capacitors

NEXC Series

1. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.

2. 2x reflow process maximum. Capacitor should be allowed to return to room temperature before second reflow process.