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DS1306EN Scheda tecnica(PDF) 12 Page - Dallas Semiconductor |
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DS1306EN Scheda tecnica(HTML) 12 Page - Dallas Semiconductor |
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12 / 20 page ![]() DS1306 12 of 20 SPI MULTIPLE-BYTE BURST TRANSFER Figure 9 3-WIRE INTERFACE The 3-wire interface mode operates similar to the SPI mode. However, in 3-wire mode there is one I/O instead of separate data in and data out signals. The 3-wire interface consists of the I/O (SDI and SDO pins tied together), CE, and SCLK pins. In 3-wire mode, each byte is shifted in LSB first unlike SPI mode where each byte is shifted in MSB first. As is the case with the SPI mode, an address byte is written to the device followed by a single data byte or multiple data bytes. Figure 10 illustrates a read and write cycle. In 3-wire mode, data is input on the rising edge of SCLK and output on the falling edge of SCLK. 3-WIRE SINGLE BYTE TRANSFER Figure 10 SINGLE BYTE READ SINGLE BYTE WRITE I/O is SDI and SDO tied together In burst mode, RST is kept high and additional SCLK cycles are sent until the end of the burst. RST SCLK I/O A0 A1 A2 A3 A4 A5 A6 A7 RST SCLK I/O D0 D1 D2 D3 D4 D5 D6 D7 A0 A1 A2 A3 A4 A5 A6 A7 |
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