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ZSPM4022-06 Scheda tecnica(PDF) 6 Page - List of Unclassifed Manufacturers |
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ZSPM4022-06 Scheda tecnica(HTML) 6 Page - List of Unclassifed Manufacturers |
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6 / 38 page ![]() ZSPM4022-06 12V/6A Synchronous DC/DC Buck Regulator Data Sheet August 29, 2013 © 2013 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 6 of 37 1 IC Characteristics The absolute maximum ratings are stress ratings only. The device might not function or be operable above the operating conditions given in section 1.2. Stresses exceeding the absolute maximum ratings might also damage the device. In addition, extended exposure to stresses above the recommended operating conditions might affect device reliability. ZMDI does not recommend designing to the “Absolute Maximum Ratings.” 1.1. Absolute Maximum Ratings PARAMETER SYMBOL CONDITIONS MIN MAX UNITS Voltage PVIN pin to PGND pin VPVIN(max) 0.3 +29 V Voltage VIN pin to PGND pin VIN(max) 0.3 VPVIN V Voltage PVDD or VDD pin to PGND pin VPVDD(max) VVDD(max) 0.3 +6V V Voltage SW or CS pin to PGND pin VSW(max) VCS(max) 0.3 (VPVIN +0.3V) V Voltage BST pin to SW pin 0.3 6 V Voltage BST pin to PGND pin VBST(max) 0.3 35 V Voltage EN pin to PGND pin VEN(max) 0.3 (VIN + 0.3V) V Voltage FB or PG pin to PGND pin VFB(max) VPG(max) 0.3 (VDD + 0.3V) V Voltage PGND pin to SGND pin 0.3 +0.3 V Junction Temperature TJ +150 °C Storage Temperature TS 65 +150 °C Lead Temperature (soldering, 10s) 260 °C ESD Rating 1) Human body model, 1.5kΩ in series with 100pF 1000 V 1) Devices are ESD sensitive. Handling precautions are recommended. 1.2. Operating Conditions PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage (PVIN, VIN pins) VPVIN, VIN 4.5 19 V Bias Voltage (PVDD, VDD pins) VPVDD, VDD 4.5 5.5 V Enable Input VEN 0 VIN V Junction Temperature 1) TJ 40 +125 C QFN28 Package Thermal Resistance 1) JA Junction to ambient 28 C/W JC Junction to case 2.5 C/W 1) Maximum Power Dissipation PD(MAX) = (TJ(MAX) – TA)/ JA, where JA depends upon the printed circuit layout and TA is the ambient temperature. See section 3.2. |
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