M24C08 datasheet(31/34 Pages) STMICROELECTRONICS

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M24C01/02-W M24C01/02-R M24C02-F

Package mechanical data

Figure 15. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

1. Drawing is not to scale.

2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 21. UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

0.550

0.450

0.600

0.0217

0.0177

0.0236

0.020

0.000

0.050

0.0008

0.0000

0.0020

0.250

0.200

0.300

0.0098

0.0079

0.0118

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

0.500

–

0.0197

–

K (rev MC)

–

0.300

–

0.0118

–

0.300

0.500

–

0.0118

0.0197

–

0.150

–

0.0059

–

0.300

–

0.0118

–

eee(2)

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

–

0.080

–

0.0031

–

ZW_MEeV2

eee

Pin 1

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