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L-T670WDT-CW1-R Scheda tecnica(PDF) 13 Page - PARA LIGHT ELECTRONICS CO., LTD. |
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L-T670WDT-CW1-R Scheda tecnica(HTML) 13 Page - PARA LIGHT ELECTRONICS CO., LTD. |
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13 / 16 page ![]() SURFACE MOUNT DEVICE LED Part No. : LT670WDT-CW1-R REV: A / 0 l CAUTIONS 1. Static Electricity: * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria: (VF>2.0V,at IF=0.5m A ) 2. Storage : * Before opening the package : The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. * After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to reseal the moisture proof bag again. If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should e performed using the following conditions. Baking treatment: more than 24hours at 65±5℃. * Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3. Soldering: Do not apply any stress to the LED lens during soldering while the LED is at high temperature. Recommended soldering condition. * Reflow Soldering : Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max. * Soldering Iron : (Not recommended) Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering. DRAWING NO. : DS-7A-11-0020 DATE : 2011-12-12 PAGE 13 of 16 PARA-FOR-068 Release by PARA LIGHT DCC |
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