EM357 Mini Modules

Page 12

This document is subject to change without notice

Document No: 0011-00-07-00-000 (Issue H)

Rework

The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be

programmable and the solder joint and module should not exceed the maximum peak reflow temperature

of 250ºC.

Caution

If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to

thermal shock. Avoid overheating.

Warning

Never attempt a rework on the module itself (i.e., replacing individual components); such actions will terminate

warranty coverage.

Additional Grounding

Attempts to improve the module or the system grounding by soldering braids, wires or cables onto the module

RF shield cover is done at the customer's own risk. The ground pins at the module perimeter should be sufficient

for optimum immunity to external RF interference.