• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

3

GaAs MMIC Voltage Variable Absorptive Attenuator

DC - 12 GHz

Rev. V4

MAAA2000G

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Handling Procedures

Permanent damage to the MAAA2000G may occur if the following precautions are not adhered to:

A. Cleanliness - The MAAA2000G should be handled in a clean environment.

DO NOT attempt to clean

assembly after the MAAA2000G is installed.

B. Static Sensitivity - All die handling equipment and personnel should be DC grounded.

C. Transients - Avoid instrument and power supply transients while bias is connected to the MAAA2000G. Use

shielded signal and bias cables to minimize inductive pick-up.

D. Bias - Apply voltage to either control port A1/B2 or A2/B1 only when the other is grounded. Neither port

should be allowed to “float”.

E. General Handling - It is recommended that the MAAA2000G chip be handled along the long side of the die

with a sharp pair of bend tweezers. DO NOT touch the surface of the chip with fingers or tweezers.

Bonding

A. Ball or wedge bond with 1.0 mil diameter pure gold wire.

Thermosonic bonding with a nominal stage

temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams

is recommended.

Ultrasonic energy and time should be adjusted to the minimum levels necessary to

achieve reliable wirebonds.

B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as

possible; at least three and no more than four bond wires from ground pads to package are recommended.

Mounting

The MAAA2000G is back-metallized with Pd/Ni/Au (100/1,000/10,000Å) metallization. It can be die-mounted

using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat

before attachment.

Eutectic Die Attach:

A. An 80/20 Au/Sn preform is recommended with a work surface temperature of approximately 255°C and a

tool temperature of 265°C. When hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be

approximately 290°C.

B. DO NOT expose the MAAA2000G to a temperature greater than 320°C for more than 20 seconds. No more

than 3 seconds of scrubbing should be required for attachment.

Epoxy Die Attach:

A. Apply a minimum amount of epoxy and place the MAAA2000G into position. A thin epoxy fillet should be

visible around the perimeter of the die.

B. Cure epoxy per manufacturer’s recommended schedule.

C. Electrically conductive epoxy is recommended but is not required.