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ACT2802QL-T Scheda tecnica(PDF) 15 Page - Active-Semi, Inc |
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ACT2802QL-T Scheda tecnica(HTML) 15 Page - Active-Semi, Inc |
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15 / 21 page ![]() ACT2802 Rev 0, 21-Jan-14 Innovative PowerTM - 15 - www.active-semi.com Copyright © 2013 Active-Semi, Inc. Active-Semi Confidential―Do Not Copy or Distribute ActiveSwitcher TM is a trademark of Active-Semi. When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the IC. 1. Arrange the power components to reduce the AC loop size, VIN pin, Vout pin, SW pin and the schottky diode. 2. Place input decoupling ceramic capacitor C3 and R10 as close to VIN pin as possible. Resistor R10 is added in series with capacitor C3 to damp the potential LC resonance . 3. Use copper plane for power GND for best heat dissipation and noise immunity. 4. Place CSP and CSN capacitor C6 (10nF) close to CSP and CSN pin as possible, use Kevin Sense from sense resistor R2 and R2A to CSP and CSN pins. 22uF decoupling capacitor is added close to BAT pin. 5. Place the ceramic capacitor C2 and D1 as close to VOUT and PGND as possible, SW goes under the C2 (recommend C2 to use 1206 size). SW pad is a noisy node switching. It should be isolated away from the rest of circuit for good EMI and low noise operation. 6. Thermal pad is connected to GND layer through vias (recommend 4X4 pins and the aperture is 10mil). Ground plane, PGND and AGND is single point connected under the ACT2802 thermal pad through vias to limited SW area. 7. From BAT pin to the Battery positive terminal, need to lay the divided line to ensure the battery voltage accuracy of sampling. 8. RC snubber is recommended to add across SW to PGND to reduce EMI noise. 1A /20V schottky is added to across VOUT and SW pins. A demo board PCB layout example is shown in the figure 19. Top Layer Figure 19. PCB Layout Bottom Layer PC Board Layout Guidance |
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