LM397 datasheet(2/15 Pages) TI1

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LM397

SNOS977D – MAY 2001 – REVISED MARCH 2013

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Absolute Maximum Ratings

(1) (2)

ESD Tolerance(3)

Human Body Model

2KV

Machine Model

200V

VIN Differential

30V

Supply Voltages

30V or ±15V

Voltage at Input Pins

−0.3V to 30V

Storage Temperature Range

−65°C to +150°C

Junction Temperature(4)

+150°C

Soldering Information

Infrared or Convection (20 sec.)

235°C

Wave Soldering (10 sec.)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

Operating Ratings

(1)

Supply Voltage, VS

5V to 30V

Temperature Range(2)

−40°C to +85°C

Package Thermal Resistance(2)

5-Pin SOT-23

168°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

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