TSL1401CS−LF

128 × 1 LINEAR SENSOR ARRAY WITH HOLD

TAOS072E − APRIL 2007

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Copyright E 2007, TAOS Inc.

The LUMENOLOGY r Company

www.taosinc.com

MANUFACTURING INFORMATION

Moisture Sensitivity

Optical characteristics of the device can be adversely affected during the soldering process by the release and

vaporization of moisture that has been previously absorbed into the package molding compound. To ensure the

package molding compound contains the smallest amount of absorbed moisture possible, each device is

dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica

gel to protect them from ambient moisture during shipping, handling, and storage before use.

This package has been assigned a moisture sensitivity level of MSL 2 and the devices should be stored under

the following conditions:

Temperature Range

5°C to 50°C

Relative Humidity

60% maximum

Floor Life

1 year out of bag at ambient < 30°C / 60% RH

Rebaking will be required if the aluminized envelope has been open for more than 1 year. If rebaking is required,

it should be done at 90°C for 3 hours.