STPS1L40AY datasheet(4/9 Pages) STMICROELECTRONICS

4 / 9 page

Characteristics

STPS1L40-Y

4/9

Doc ID 18247 Rev 1

Figure 7.

Non repetitive surge peak forward

current versus overload duration

(maximum values, SMB)

Figure 8.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMA)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

IM(A)

δ = 0.5

Ta = 25 °C

Ta = 75 °C

Ta = 125 °C

SMB

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Single pulse

SMA

Zth(j-a)/Rth(j-a)

tp(s)

Epoxy printed circuit board,

copper thickness = 35 µm,

recommended pad layout

Figure 9.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMB)

Figure 10.

Reverse leakage current versus

reverse voltage applied

(typical values)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Zth(j-a)/Rth(j-a)

Single pulse

SMB

tp(s)

Epoxy printed circuit board,

copper thickness = 35 µm,

recommended pad layout

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

VR(V)

IR(mA)

Tj = 25 °C

Tj = 50 °C

Tj = 75 °C

Tj = 125 °C

Tj = 150 °C

Tj = 100 °C

Figure 11.

Junction capacitance versus

reverse voltage applied

(typical values)

Figure 12.

Forward voltage drop versus

forward current

(typical values, high level)

100

1000

100

VR(V)

C(pF)

F = 1 MHz

Vosc = 30 mVRMS

Tj = 25 °C

0.01

0.10

1.00

10.00

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

Tj = 125 °C

Tj = 25 °C

VFM(V)

IFM(A)

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