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STB21NK50Z Scheda tecnica(PDF) 3 Page - STMicroelectronics |
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STB21NK50Z Scheda tecnica(HTML) 3 Page - STMicroelectronics |
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3 / 13 page ![]() STB21NK50Z Electrical ratings 3/13 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage (VGS = 0) 500 V VGS Gate-source voltage ± 30 V ID Drain current (continuous) at TC = 25 °C 17 A ID Drain current (continuous) at TC=100 °C 10.71 A IDM (1) 1. Pulse width limited by safe operating area Drain current (pulsed) 68 A PTOT Total dissipation at TC = 25 °C 190 W Derating Factor 1.51 W/°C Vesd(G-S) G-S ESD (HBM C=100 pF, R=1.5 k Ω) 6000 V dv/dt(2) 2. ISD ≤ 17 A, di/dt ≤ 200 A/µs,VDD ≤ V(BR)DSS, TJ ≤ TJMAX Peak diode recovery voltage slope 4.5 V/ns Tstg Storage temperature -55 to 150 °C TJ Max operating junction temperature 150 °C Table 3. Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 0.66 °C/W Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W Tl Maximum lead temperature for soldering purpose 300 °C Table 4. Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max) 17 A EAS Single pulse avalanche energy (starting TJ=25 °C, ID=IAR, VDD=50 V) 850 mJ |
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