| Motore di ricerca datesheet componenti elettronici |
|
ML22Q563 Scheda tecnica(PDF) 63 Page - List of Unclassifed Manufacturers |
|
|
|||||||||||||||||||||||||||||
ML22Q563 Scheda tecnica(HTML) 63 Page - List of Unclassifed Manufacturers |
|
63 / 66 page ![]() FEDL2257X-05 ML22Q573/ML2257X PACKAGE DIMENSIONS Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). Notes for heat sink type Package This LSI adopts a heat sink type package to raise a radiation of heat characteristic. Be sure to design the land pattern corresponding to the heat sink area of the LSI on a board, and solder each other. The heat sink area of the LSI solder open or GND on the board. Be sure to refer to the next clause reference data ( Mounting area for package lead soldering to PC boards ). 63/66 |
|
Link URL |
| Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |