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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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SC009221 Scheda tecnica(PDF) 10 Page - List of Unclassifed Manufacturers |
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SC009221 Scheda tecnica(HTML) 10 Page - List of Unclassifed Manufacturers |
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10 / 12 page  E Ink® Evaluation Guide 10 Vendor URL Contact Info Hirose www.hirose.com Contact Hirose Support Molex www.molex.com Contact Molex Support Kyocera www.kyocera.com Contact Kyocera 4.2 ACF Tape Connections ACF Tape is the recommended connection method for E Ink Segmented displays which have a larger number of pin outs. The ACF bonding process involves the application of anisotropic tape to a substrate, with the bond being completed by a combination of heat, pressure and time. Anisotropic film is comprised of an epoxy/acrylate adhesive matrix loaded with conductive particles. The particles allow interconnection of circuit lines after bonding. ACF tape can be used to bond one FPC to another FPC or to a PCB. Final bonding must be done with a typical bond line temperature of 135 - 150°C. For more information on ACF Technology: 3M Anisotropic Tape Using ACF Tapes |
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