Pad Coordinates

Unit:

Pad

No.

XY

Pad

No.

XY

1

–1138.00 796.50

14 1141.50 –547.00

2

–1141.00 523.50

15 1141.50 –197.50

3

–1136.50 201.50

16 1141.50 111.50

4

–1136.50 –163.00

17 1141.50 461.00

5

–1137.00 –507.00

18 1141.50 770.50

6

–1149.00 –774.00

19

896.00

811.00

7

–854.50 –853.50

20

645.00

810.50

8

–548.00 –831.50

21

435.00

794.00

9

–198.50 –831.50

21

335.00

794.00

10

111.50

–831.50

22

150.00

779.00

11

461.00

–831.50

23

–35.00

779.00

12

773.00

–831.50

25 –264.00 806.00

13

1122.50 –831.50

Chip size: 2170

* The IC substrate should be connected to VSS in the PCB layout artwork.

Pin Description

Pin No. Pin Name I/O

Internal

Connection

Description

1

BIAS

O

OP Non-inverted

Internal pre-amplifier bias

Connects to a decoupling capacitor

2

IN

I

OP Inverted

Audio signal input pin (inverted)

3

PREO

O

OP OUTPUT

Pre-amplifier output pin

4

OUT

O

—

Delayed audio signal output pin

5

SEL

I

Pull-High

DRAM type selection:

VDD or Open: 64Kb

VSS: 256Kb

6

OSC1

I

—

System oscillator input

7

OSC2

O

—

System oscillator output

8

OSC3

I

—

Delay time control oscillator input

9

OSC4

O

—

Delay time control oscillator output

10

VSS

I

—

Negative power supply (GND)

11

A6

O

CMOS OUT

Connects to DRAM A6

12

A7

O

CMOS OUT

Connects to DRAM A7

HT8955A

2

5th May ’98