80960HA datasheet(32/102 Pages) INTEL

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80960HA/HD/HT

Advance Information Datasheet

3.4

Heat Sink Adhesives

Intel recommends silicone-based adhesives to attach heat sinks to the PGA package. There is no

particular recommendation concerning the PQ4 package.

3.5

PowerQuad4 Plastic Package

The 80960Hx family is available in an improved version of the common 208-lead SQFP plastic

package called the PowerQuad4* (PQ4). The PQ4 package dimensions and lead pitch are identical

to the SQFP package and the former PQ2 package, so the PQ4 fits into the same board footprint.

The advantage of the PQ4 package is the superior thermal conductivity that allows the plastic

version of the 80960Hx to operate with the same 0-85°C temperature specifications as the more

expensive ceramic PGA package.

The PQ4 package integrates a copper heat sink within the package to dissipate heat effectively. See

Table 14 and Table 15.

3.6

Stepping Register Information

The memory-mapped register at FF008710H contains the 80960Hx Device ID. The ID is identical

to the ID obtained from a JTAG Query. Figure 6 defines the current 80960Hx Device IDs. The

value for device identification is compliant with the IEEE 1149.1 specification and Intel standards.

Table 16 describes the fields of the device ID.

Figure 6. 80960Hx Device Identification Register

Manufacturer ID

Part Number

Version

Model

Gen

Product

Type

VCC

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