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HCS10MS Scheda tecnica(PDF) 8 Page - Intersil Corporation |
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HCS10MS Scheda tecnica(HTML) 8 Page - Intersil Corporation |
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8 / 8 page ![]() 8 HCS10MS Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20mm x 2.24mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCS10MS A1 VCC C1 B1 (2) A2 (3) B2 (4) C2 (5) (6) (7) (8) (9) A3 (10) B3 (11) C3 (12) Y1 (1) (14) (13) Y2 GND Y3 Spec Number 518747 |
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