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HCS245MS Scheda tecnica(PDF) 7 Page - Intersil Corporation |
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HCS245MS Scheda tecnica(HTML) 7 Page - Intersil Corporation |
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7 / 7 page ![]() 7-481 HCS245MS Die Characteristics DIE DIMENSIONS: 124 x 110 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± -2.6kÅ DIE ATTACH: Material: Silver Epoxy WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCS245MS DIR (1) A0 (2) A6 (8) (13) B5 VCC (20) NC NC NC NC OE (19) A1 (3) A2 (4) A3 (5) A4 (6) A5 (7) A7 (9) GND (10) B7 (11) B6 (12) (14) B4 (15) B3 (16) B2 (17) B1 (18) B0 |
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