Data Sheet G14309EJ1V0DS00

12

RECOMMENDED SOLDERING CONDITIONS

The

µPC1909 should be soldered and mounted under the following recommended conditions. For the details of

the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology

Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC

sales representative.

Insertion Type

µµµµPC1909CX: 16-pin plastic DIP (300 mils)

Soldering Method

Soldering Conditions

Wave soldering (pins only)

Solder bath temperature: 260

°C Max., Time: 10 seconds max.

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per pin)

Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with

the package.

Surface Mounting Type

µµµµPC1909GS: 16-pin plastic SOP (300 mils)

Soldering Method

Soldering Conditions

Recommended

Condition symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 seconds max.

(at 210

°C or higher), Count: Twice or less

IR35-00-2

VPS

Package peak temperature: 215

°C, Time: 40 seconds max.

(at 200

°C or higher), Count: Twice or less

VP15-00-2

Wave soldering

Soldering bath temperature: 260

°C or less, Time: 10 seconds max.,

Count: Once, Preheating temperature: 120

°C MAX.

(package surface temperature)

WS60-00-1

Caution Do not use different soldering methods together.