HIP1031 datasheet(2/4 Pages) INTERSIL

2 / 4 page

Absolute Maximum Ratings

Thermal Information

Supply Voltage, VCC. . . . . . . . . . . See O.V. Shutdown Limit, VOVSD

Input Voltage, VIN (Note 1) . . . . . . . . . . . . . . . . . . . . . . -0.8V to +7V

Load Current, IOUT . . . . . . . . . . . . . . . . . . . . . . . Internally Limiting

Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . .

±60VPEAK

Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC

Thermal Resistance (Typical, Note 2)

θJA (oC/W) θJC (oC/W)

Plastic SIP Package . . . . . . . . . . . . . .

Maximum Power Dissipation, (Note 3)

At TA = 125

oC, Inﬁnite Heat Sink. . . . . . . . . . . . . . . . . . . . . 6.25W

Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . 150

Maximum Storage Temperature Range . . . . . . . . . .-40oC to 150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC

(Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTES:

1. The Input Control Voltage, VIN, may range from -0.85V to +7V for a VCC supply voltage of 0V to +25V.

θJA is measured with the component mounted on an evaluation PC board in free air.

3. The worst case thermal resistance,

θJC for the SIP TS-001AA 5 pin package is 4oC/W. The calculation for dissipation and junction

temperature rise due to dissipation is:

PD = (VCC-VOUT)(IOUT) + (VCC)(ICCMAX - IOUT) or (VCC)(ICCMAX) - (VOUT)(IOUT)

TJ = TAMBIENT + (PD) (θJC) for an inﬁnite Heat Sink.

Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Derating from 150oC is based on the reciprocal of thermal

resistance,

θJC+θHS. For example: Where θJC = 4oC/W and given θHS = 6o/W as the thermal resistance of an external Heat Sink, the

junction-to-air thermal resistance,

θJA = 10oC/W. Therefore, for the maximum allowed dissipation, derate 0.1W/oC for each degree from

TAMB to the maximum rated junction temperature of 150

oC. If T

AMB = 100

oC, the maximum P

D is (150 - 100) x 0.1W/

oC = 5W.

Electrical Speciﬁcations

TA = -40οC to 125οC, VIN = 2V, VCC = +12V, Unless Otherwise Speciﬁed

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Operating Voltage Range

VCC

4.5

Over-Voltage Shutdown

VOVSD

RL = 1kΩ, VIN = 2V

Over-Temperature Limiting

TSD

150

Negative Pulse

Output Clamp Voltage

VCL

ICL = -100mA, VCC = 4.5V to 25V,

VIN = 0.8V

(VCC - 62)

(VCC - 37)

(VCC - 28)

Short Circuit Current Limiting

ISC

(Note 4)

0.7

1.1

1.7

Input Control ON

VIH

2.0

Input Control OFF

VIL

0.8

Input Current High

IIH

VIN = 5.5V, VCC = 6V to 24

µA

Input Current Low

IIL

VIN = 0.8V, VCC = 6V to 24V

µA

Supply Current, Full Load,

Input Control ON

ICCMAX

VIN = 2V; IOUT = 0.55A

0.6

Supply Current, No Load,

Input Control OFF

ICCMIN

VIN = 0V; IOUT = 0A

150

µA

Input-Output Forward Voltage

Drop (VCC - VOUT)

VSAT

IOUT = 0.6A, VCC = 4.5V to 25V

1.0

Output Leakage

IOUT_LK

VIN = 0.8V, VCC = 6V to 24V

µA

Turn-On Time

tON

RL = 80Ω, TA = 125°C-

µs

Turn-OFF Time

tOFF

RL = 80Ω, TA = 125°C

µs

NOTE:

4. Short Circuit current will be reduced when Thermal Shutdown occurs. Testing of a short circuit current may require a short duration pulse.

HIP1031

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