µPD3799

17

DATA SHEET S14083EJ1V0DS00

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below.

If other soldering processes are used, or if the soldering is performed under different conditions, please make sure

to consult with our sales offices.

For more details, refer to our document "Semiconductor Device Mounting Technology Manual"(C10535E).

Type of Through-hole Device

µPD3799CY : CCD linear image sensor 32-pin plastic DIP (400 mil)

Caution

During assembly care should be taken to prevent solder or flux from contacting the plastic cap.

The optical characteristics could be degraded by such contact.

Conditions

Pin temperature: 300

°C or below,

Heat time: 3 seconds or less (per pin)

Process

Partial heating method