Storage Temperature Range

Solder Temperature

(10 seconds)

Case Operating Temperature

Junction Temperature

0.85°C/W

-40°C to +85°C

+300°C

-40°C to +85°C

+150°C

10

-

-

3.0

1.2

-

5.9

-

-

-

-

-

44

15

100

-

-

-

-

6.24

0.37

-

-

90

5

50

PWM Clock Frequency

V+ Quiescent Current

Hall Inputs

VIL

HIL

Speed Command Input Range

Speed Command Input Current

VREF

Ouput Section

Voltage Drop Across Bridge

Leakage Current

Diode VSD

trr

Deadtime

Current Limit

+34V

+12V

+6.24V

25mA

50 Amps DC

75 Amps (10µ Sec)

High Voltage Supply

Speed Command

Hall A,B,C,Brake,Disable

VREF Output Current

Continuous Output Current @ 25°C

Peak Output Current

ABSOLUTE MAXIMUM RATINGS

2

ELECTRICAL SPECIFICATIONS

Parameter

Units

KHz

mA

V

V

V

mA

V

V

µA

V

nSEC

µSEC

Amps

Min.

Typ. Max.

20

200

0.8

-

4.5

1.5

6.57

0.45

100

1.4

-

-

56

V+=28V, BRAKE=GND, TC=25°C unless otherwise specified.

Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only.

Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle.

Internal solder reflow temperature is 180°C, do not exceed.

NOTES:

1

2

3

4

1

3

(No PWM)

(VIN=5V)

(1 Upper+1 Lower, 50Amps)

(@ V+=34V)

4

8548-148 Rev. B 1/15