µPD4723

13

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product. Please consult with our sales

offices in case other soldering process is used, or in case soldering is done under different conditions.

TYPES OF SURFACE MOUNT DEVICE

For more details, refer to our document “SMT MANUAL” (C10535E).

µPD4723GS-GJG

Soldering process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Soldring conditions

Peak package’s surface temperature: 230

°C or below,

Reflow time: 30 seconds or below (210

°C or higher),

Number of reflow process: 2, Exposure limit*: None

Peak package’s surface temperature: 215

°C or below,

Reflow time: 40 seconds or below (200

°C or higher),

Number of reflow process: 2,

Exposure limit*: None

Solder temperature: 260

°C or below,

Flow time: 10 seconds or below,

Number of flow process: 1,

Exposure limit*: None

Terminal temperature: 300

°C or below,

Flow time: 10 seconds or below,

Exposure limit*: None

Symbol

IR30-00-2

VP15-00-2

WS60-00-1

* Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25

°C and relative humidity at 65 % or less.

Note Do not apply more than a single process at once, except for “Partial heating method”.