7

LT1026

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

J8 Package

8-Lead CERDIP (Narrow 0.300, Hermetic)

(LTC DWG # 05-08-1110)

N8 Package

8-Lead PDIP (Narrow 0.300)

(LTC DWG # 05-08-1510)

J8 1197

0.014 – 0.026

(0.360 – 0.660)

0.200

(5.080)

MAX

0.015 – 0.060

(0.381 – 1.524)

0.125

3.175

MIN

0.100

± 0.010

(2.540

± 0.254)

0.300 BSC

(0.762 BSC)

0.008 – 0.018

(0.203 – 0.457)

0

° – 15°

0.005

(0.127)

MIN

0.405

(10.287)

MAX

0.220 – 0.310

(5.588 – 7.874)

12

3

4

87

65

0.025

(0.635)

RAD TYP

0.045 – 0.068

(1.143 – 1.727)

FULL LEAD

OPTION

0.023 – 0.045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

0.045 – 0.068

(1.143 – 1.727)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

N8 1197

0.100

± 0.010

(2.540

± 0.254)

0.065

(1.651)

TYP

0.045 – 0.065

(1.143 – 1.651)

0.130

± 0.005

(3.302

± 0.127)

0.020

(0.508)

MIN

0.018

± 0.003

(0.457

± 0.076)

0.125

(3.175)

MIN

12

3

4

87

6

5

0.255

± 0.015*

(6.477

± 0.381)

0.400*

(10.160)

MAX

0.009 – 0.015

(0.229 – 0.381)

0.300 – 0.325

(7.620 – 8.255)

0.325

+0.035

–0.015

+0.889

–0.381

8.255

()

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)