| Motore di ricerca datesheet componenti elettronici |
|
UPD75402ACT Scheda tecnica(PDF) 42 Page - NEC |
|
|
|||||||||||||||||||||||||||||
UPD75402ACT Scheda tecnica(HTML) 42 Page - NEC |
|
42 / 48 page ![]() 42 µPD75402A(A) 12. RECOMMENDED SOLDERING CONDITIONS The following conditions shall be met when soldering the µPD75402A(A). For details of the recommended soldering conditions, refer to our document "SMD Surface Mount Technology Manual" (IEI-1207). Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. Table 12-1 Soldering Conditions for Surface-Mount Devices µPD75402AGB(A)-×××-3B4: 44-pin plastic QFP (10 × 10 mm) Caution Do not apply more than a single process at once, except for “Partial heating method.” Table 12-2 Soldering Conditions for Insertion-Mount Devices µPD75402AC(A)-×××: 28-pin plastic DIP (600 mil) µPD75402ACT(A)-×××: 28-pin plastic shrink DIP (400 mil) Caution In wave soldering, apply solder only to the lead section. Care must be taken that jet solder does not come in contact with the main body of the package. Solder temperature: 260 ˚C or less Flow time: 10 seconds or less Terminal temperature: 260 ˚C or less Flow time: 10 seconds or less Wave soldering (Only for leads) Partial heating method Soldering process Soldering conditions Peak package’s surface temperature: 230 ˚C Reflow time: 30 seconds or less (210 ˚C or more) Number of reflow processes: 1 Peak package’s surface temperature: 215 ˚C Reflow time: 40 seconds or less (200 ˚C or more) Number of reflow processes: 1 Solder temperature: 260 ˚C or less Flow time: 10 seconds or less Number of flow processes: 1 Preheating temperature: 120 ˚C max. (measured on the package surface) Terminal temperature: 300 ˚C or less Flow time: 3 seconds or less (for each side of device) Soldering process Infrared ray reflow VPS Wave soldering Partial heating method Symbol IR30-00-1 VP15-00-1 WS60-00-1 — Soldering conditions Notice Other versions of the products are available. For these versions, the recommended reflow soldering conditions have been mitigated as follows: Higher peak temperature (235 °C), two-stage, and longer exposure limit. Contact an NEC representative for details. |
|
Link URL |
| Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |