28.04.2015

H2A1-H365

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Soldering Conditions

Reflow Soldering:

APG2C1 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use

a reflow soldering process for array assembly!

Hot Bar Soldering:

A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process

will only transfer heat to the leads and avoids overheating the emitter which will damage the

device. In order to transfer sufficient heat from the hot bar to the device, following parameters

must be carefully considered:

•

Amount of flux

•

Pressing force of solder tip

•

Hot bar temperature

For the standard assembly process, following parameters should be maintained:

•

Hot Bar temperature: 330 °C

•

Force of Hot Bar. 40 N

•

Soldering time: 1.5 s

It is recommended to use a copper nickel-plated hot bar mounted to standard temperature

controlled soldering equipment.

Manual Hand Soldering:

For prototype build or small series production runs, it is possible to place and solder the

emitters by hand. It is therefore recommended to maintain the following parameters:

•

Solder Tip Temperature 330 °C

•

Soldering time. < 1.5 s

•

Junction temperature must be kept below 70 °C

A visual inspection may be used to check the quality of the solder joint

General Soldering Precautions:

•

Mechanical stress, shock and vibration must be avoided during soldering

•

Only use non corrosive flux.

•

Do not apply current to the device until it has cooled down to room temperature after

soldering.