| Motore di ricerca datesheet componenti elettronici |
|
BCP53 Scheda tecnica(PDF) 18 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
BCP53 Scheda tecnica(HTML) 18 Page - NXP Semiconductors |
|
18 / 22 page ![]() BCP53_BCX53_BC53PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 9 — 19 October 2011 18 of 22 NXP Semiconductors BCP53; BCX53; BC53PA 80 V, 1 A PNP medium power transistors Reflow soldering is the only recommended soldering method. Fig 26. Reflow soldering footprint SOT1061 (HUSON3) occupied area solder paste = solder lands Dimensions in mm sot1061_fr solder resist 0.4 2.1 1.3 0.25 0.25 0.25 1.1 1.2 0.55 0.6 2.3 0.5 (2 ×) 0.5 (2 ×) 0.6 (2×) 0.4 (2 ×) 0.5 1.6 1.7 1.05 |
|
|
Link URL |
| Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |