DRV5053_15 datasheet(4/24 Pages) TI

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DRV5053

SLIS153B – MAY 2014 – REVISED SEPTEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

–22(2)

Power supply voltage

Voltage ramp rate (VCC), VCC < 5 V

Unlimited

V/µs

Voltage ramp rate (VCC), VCC > 5 V

Output pin voltage

OUT

–0.5

2.5

Output pin reverse current during

OUT

–20

reverse supply condition

Operating junction temperature

–40

150 (3)

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Ensured by design. Only tested to –20 V.

(3)

Tested in production to TA = 125°C.

7.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

–2.5

2.5

Electrostatic

V(ESD)

discharge

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

–500

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Power supply voltage

2.5

VOUT

Output pin voltage (OUT)

ISOURCE

Output pin current source (OUT)

300

µA

ISINK

Output pin current sink (OUT)

2.3

Operating ambient temperature

–40

125

°C

7.4 Thermal Information

DRV5053

THERMAL METRIC(1)

DBZ

LPG

UNIT

3 PINS

RθJA

Junction-to-ambient thermal resistance

333.2

180

RθJC(top)

Junction-to-case (top) thermal resistance

99.9

98.6

RθJB

Junction-to-board thermal resistance

66.9

154.9

°C/W

ψJT

Junction-to-top characterization parameter

4.9

ψJB

Junction-to-board characterization parameter

65.2

154.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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