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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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0512TQ Scheda tecnica(PDF) 9 Page - Gennum Corporation |
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0512TQ Scheda tecnica(HTML) 9 Page - Gennum Corporation |
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9 / 13 page  RClamp0512TQ Final Datasheet Rev 5.0 June 12, 2015 www.semtech.com Page 9 Semtech Applications Information Assembly Guidelines Thesmallsizeofthisdevicemeansthatsomecaremust betakenduringthemountingprocesstoinsurereliable solderjoints.ThefigureattherightdetailsSemtech’s recommendedmountingpattern.Recommended assemblyguidelinesareshowninTable2.Notethat theseareonlyrecommendationsandshouldserveonly asastartingpointfordesignsincetherearemanyfactors thataffecttheassemblyprocess.Exactmanufacturing parameterswillrequiresomeexperimentationtogetthe desiredsolderapplication.Semtech’srecommended mountingpatternisbasedonthefollowingdesign guidelines: Land Pattern TherecommendedlandpatternfollowsIPCstandardsandis designedformaximumsoldercoverage.Detaileddimensions areshownelsewhereinthisdocument. Solder Stencil Stencildesignisoneofthekeyfactorswhichwilldetermine thevolumeofsolderpastewhichisdepositedontotheland pad.Thearearatioofthestencilaperturewilldeterminehow wellthestencilwillprint.Thearearatiotakesintoaccountthe apertureshape,aperturesize,andstencilthickness.Anarea ratioof0.70–0.75ispreferredforthesubjectpackage.The arearatioofarectangularapertureisgivenas: AreaRatio=(L*W)/(2*(L+W)*T) Where: L=ApertureLength W=ApertureWidth T=StencilThickness Semtechrecommendsastencilthicknessof0.100mmfor thisdevice.Thestencilshouldbelasercutwithelectro- polishedfinish.Thestencilshouldhaveapositivetaperof approximately5degrees.Electropolishingandtapering thewallsresultsinreducedsurfacefrictionandbetterpaste release.Duetothesmallaperturesize,asolderpastewith Type4orsmallerparticlesarerecommended.Assuminga 100umthickstencil,theaperturedimensionsshownwillyield anarearatioofapproximately0.75. Recommended Mounting Pattern Stencil Opening (220x480 mm) Land Pad (200x430 mm) All Dimensions are in mm. Component 1.000 .850 Table 2 - Recommended Assembly Guidelines Assembly Parameter Recommendation SolderStencilDesign LaserCut,Electro-Polished ApertureShape Rectangular SolderStencilThickness 0.100mm(0.004”) SolderPasteType Type4sizesphereorsmaller SolderReflowProfile PerJEDECJ-STD-020 PCBSolderpadDesign Non-SolderMaskDefined PCBPadFinish OSPorNiAu |
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