MIC79050 datasheet(14/20 Pages) MICREL

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MIC79050

Micrel

MIC79050

June 2000

100

200

300

400

500

600

700

800

900

0.25 0.50 0.75 1.00 1.25 1.50

POWER DISSIPATION (W)

°C

°C 25°C

= 125

°C

Figure 10. Copper Area vs. Power-SOP

Power Dissipation (T

Power MSOP-8 Thermal Characteristics

The power-MSO-8 package follows the same idea as the

power-SO-8 package, using four ground leads with the die

attach paddle to create a single-piece electrical and thermal

conductor, reducing thermal resistance and increasing power

dissipation capability.

The same method of determining the heat sink area used for

the power-SOP-8 can be applied directly to the power-

MSOP-8. The same two curves showing power dissipation

versus copper area are reproduced for the power-MSOP-8

and they can be applied identically.

Quick Method

Determine the power dissipation requirements for the design

along with the maximum ambient temperature at which the

device will be operated. Refer to Figure 12, which shows safe

operating curves for 3 different ambient temperatures, +25

°C,

+50

°C and +85°C. From these curves, the minimum amount

of copper can be determined by knowing the maximum power

dissipation required. If the maximum ambient temperature is

+25

°C and the power dissipation is 1W, the curve in Figure

12v shows that the required area of copper is 500mm2,when

using the power MSOP-8

100

200

300

400

500

600

700

800

900

0.25 0.50 0.75 1.00 1.25 1.50

POWER DISSIPATION (W)

Figure 11. Copper Area vs. Power-MSOP

Power Dissipation (

∆T

JA)

100

200

300

400

500

600

700

800

900

0.25 0.50 0.75 1.00 1.25 1.50

POWER DISSIPATION (W)

°C

°C 25°C

= 125

°C

Figure 12. Copper Area vs. Power-MSOP

Power Dissipation (T

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