LP3961, LP3964

SNVS056J – MAY 2000 – REVISED JUNE 2015

www.ti.com

Table of Contents

7.4

Device Functional Modes........................................ 13

1

Features .................................................................. 1

8

Application and Implementation ........................ 14

2

Applications ........................................................... 1

8.1

Application Information .......................................... 14

3

Description ............................................................. 1

8.2

Typical Applications ................................................ 14

4

Revision History..................................................... 2

9

Power Supply Recommendations ...................... 19

5

Pin Configurations and Functions ....................... 3

10

Layout................................................................... 19

6

Specifications......................................................... 4

10.1

Layout Guidelines ................................................. 19

6.1

Absolute Maximum Ratings ...................................... 4

10.2

Layout Example .................................................... 19

6.2

ESD Ratings.............................................................. 4

10.3

Heatsinking TO-220 Packages ............................. 20

6.3

Recommended Operating Conditions ....................... 4

11

Device and Documentation Support ................. 21

6.4

Thermal Information .................................................. 4

11.1

Related Links ........................................................ 21

6.5

Electrical Characteristics........................................... 5

11.2

Community Resources.......................................... 21

6.6

Typical Characteristics ............................................. 7

11.3

Trademarks ........................................................... 21

7

Detailed Description ............................................ 10

11.4

Electrostatic Discharge Caution ............................ 21

7.1

Overview ................................................................. 10

11.5

Glossary ................................................................ 21

7.2

Functional Block Diagram ....................................... 10

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................. 11

Information ........................................................... 21

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision I (December 2014) to Revision J

Page

•

•

Changed "I" to "O" to correct I/O type for ERROR flag ......................................................................................................... 3

•

Deleted Lead temperature row - info in POA ........................................................................................................................ 4

•

Deleted heatsinking sections re TO-263 and SOT-223 packages; not consistent with updated thermal metrics .............. 20

Changes from Revision H (April 2013) to Revision I

Page

•

Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

Changes from Revision G (April 2013) to Revision H

Page

2

Submit Documentation Feedback

Copyright © 2000–2015, Texas Instruments Incorporated

Product Folder Links: LP3961 LP3964