PIC16LC554 datasheet(86/96 Pages) MICROCHIP

86 / 96 page

PIC16C55X(A)

DS40143B-page 86

Preliminary

11.5

Package Marking Information

Legend: MM...M Microchip part number information

XX...X

Customer speciﬁc information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Facility code of the plant at which wafer is manufactured

C = Chandler, Arizona, U.S.A.

Mask revision number

Assembly code of the plant or country of origin in which

part was assembled

Note:

In the event the full Microchip part number cannot be marked on one line,

it will be carried over to the next line thus limiting the number of available

characters for customer speciﬁc information.

Standard OTP marking consists of Microchip part number, year code, week

code, facility code, mask rev#, and assembly code. For OTP marking beyond

this, certain price adders apply. Please check with your Microchip Sales Ofﬁce.

For QTP devices, any special marking adders are included in QTP price.

20-Lead SSOP

XXXXXXXXXX

AABBCDE

XXXXXXXXXX

XXXXXXXX

AABBCDE

18-Lead CERDIP Windowed

18-Lead SOIC (.300")

XXXXXXXXXXXX

AABBCDE

XXXXXXXXXXXX

XXXXXXXXXXXXXXXX

AABBCDE

18-Lead PDIP

Example

-04I / 218

9551 CBP

PIC16C558A

16C558

/JW

9501 CBA

Example

-04I / S0218

9518 CDK

PIC16C558

PIC16C558A

-04I / P456

9523 CBA

Example

PIC16LC554 Scheda tecnica(PDF) 86 Page - Microchip Technology

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