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UF830KL-TN3-R Scheda tecnica(PDF) 4 Page - Unisonic Technologies |
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UF830KL-TN3-R Scheda tecnica(HTML) 4 Page - Unisonic Technologies |
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4 / 7 page ![]() UF830K-MT Power MOSFET UNISONICTECHNOLOGIESCO.,LTD 4 of 7 www.unisonic.com.tw QW-R209-030.D ELECTRICAL SPECIFICATIONS (TA =25°C, unless otherwise specified.) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS ID=250μA, VGS=0V 500 V On-State Drain Current (Note 1) ID(ON) VDS>ID(ON)×RDS(ON)MAX, VGS=10V 4.5 A Drain-Source Leakage Current IDSS VDS= Rated BVDSS, VGS=0V 25 μA VDS=0.8×Rated BVDSS VGS=0V, TJ= 125°C 250 μA Gate-Source Leakage Current IGSS VGS=±30V ±100 nA ON CHARACTERISTICS Gate Threshold Voltage VGS(TH) VGS=VDS, ID=250μA 2.0 4.0 V Static Drain-Source On-State Resistance RDS(ON) ID=2.5A, VGS=10V (Note 2) 1.50 Ω DYNAMIC PARAMETERS Input Capacitance CISS VDS=25V, VGS=0V, f=1.0MHz 420 pF Output Capacitance COSS 66 pF Reverse Transfer Capacitance CRSS 6.5 pF SWITCHING PARAMETERS Turn-On Delay Time tD(ON) VDD=30V, ID≈0.5A RGS=25Ω (Note 2) 48 ns Turn-On Rise Time tR 48 ns Turn-Off Delay Time tD(OFF) 42 ns Turn-Off Fall Time tF 44 ns Total Gate Charge QG VGS=10V, ID=1.3A, VDD=50V IG=100mA (Note 3) 13.8 nC Gate-Source Charge QGS 5.4 nC Gate-Drain Charge QGD 6.0 nC Notes: 1. Pulse Test: Pulse width≤300μs, Duty Cycle≤2%. 2. MOSFET Switching Times are Essentially Independent of Operating Temperature. 3. Gate Charge is Essentially Independent of Operating Temperature. SOURCE TO DRAIN DIODE SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Source to Drain Diode Voltage VSD TJ=25°C,ISD=4.5A, VGS=0V(Note 1) 1.6 V Continuous Source to Drain Current ISD (Note 2) 5.5 A Pulse Source to Drain Current ISDM 18 A Notes: 1. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2%. 2. Modified MOSFET symbol showing the integral reverse P-N junction diode as below. |
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