TPS54341

SLVSC61 – NOVEMBER 2013

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ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

VIN

–0.3

45

EN

–0.3

8.4

BOOT

53

FB

–0.3

3

Input voltage

V

COMP

–0.3

3

PWRGD

–0.3

6

SS/TR

–0.3

3

RT/CLK

–0.3

3.6

BOOT-SW

8

Output voltage

SW

–0.6

45

V

SW, 10-ns Transient

–2

45

Electrostatic Discharge (HBM) QSS 009-105 (JESD22-A114A)

2

kV

Electrostatic Discharge (CDM) QSS 009-147 (JESD22-C101B.01)

500

V

Operating junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TPS54341

UNITS

DPR (10 PINS)

Junction-to-ambient thermal resistance (standard board)

35.1

Junction-to-top characterization parameter

0.3

Junction-to-board characterization parameter

12.5

°C/W

Junction-to-case(top) thermal resistance

34.1

Junction-to-case(bottom) thermal resistance

2.2

Junction-to-board thermal resistance

12.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where

distortion starts to substantially increase. See power dissipation estimate in application section of this data sheet for more information.

4

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