ML2264

2

PIN# NAME

FUNCTION

PIN# NAME

FUNCTION

1

A IN 4

Analog input 4.

2

A IN 3

Analog input 3.

3

A IN 2

Analog input 2.

4

A IN 1

Analog input 1.

5

MODE

Mode select input.

MODE = GND: RD mode

Pin has internal current source

pulldown to GND.

6

DB0

Data output — bit 0 (LSB).

7

DB1

Data output — bit 1.

8

DB2

Data output — bit 2.

8

DB3

Data output — bit 3.

10 RD

Read input. In RD mode, this pin

initiates a conversion. In WR-RD

mode, this pin latches data into output

latches. See Digital Interface section.

11 INT

Interrupt output. This output signals

the end of a conversion and indicates

that data is valid on the data outputs.

See Digital Interface section.

12 GND

Ground.

Negative reference voltage for

A/D converter.

Positive reference voltage for

A/D converter.

PIN DESCRIPTION

15 WR/RDY

Write input or ready output. In WR-RD

mode, this pin is WR input. In RD

mode, this pin is RDY open drain

output. See Digital Interface section.

16 CS

Chip select input. This pin must be

held low for the device to perform a

conversion.

17 DB4

Data output — bit 4.

18 DB5

Data output — bit 5.

19 DB6

Data output — bit 6.

20 DB7

Data output — bit 7 (MSB).

21 A1

Digital address input 1 that selects

analog input channel. See multiplexer

addressing section.

22 A0

Digital address input 0 that selects

analog input channel. See multiplexer

addressing section.

23 SH/TH

S/H, T/H mode select. When SH/TH =

mode. When SH/TH = GND, the

device is in track and hold mode. Pin

has internal pulldown current source

to GND.

Positive supply. +5 volts ± 5%.

ABSOLUTE MAXIMUM RATINGS

Absolute maximum ratings are those values beyond which

the device could be permanently damaged. Absolute

maximum ratings are stress ratings only and functional

device operation is not implied.

Voltage

Input Current per Pin (Note 2) .............................. ±25mA

Storage Temperature .............................. –65°C to +150°C

Package Dissipation

Lead Temperature (Soldering 10 sec.)

Dual-In-Line Package (Plastic) ............................ 260°C

Dual-In-Line Package (Ceramic) ......................... 300°C

SOIC

Vapor Phase (60 sec.) ..................................... 215°C

Infrared (15 sec.) ............................................ 220°C

OPERATING CONDITIONS

ML2264CCS

ML2264CCP

ML2264CCR ........................................... 0°C to +70°C