TPS61253_15 datasheet(5/33 Pages) TI

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TPS61253, TPS61254, TPS61256, TPS61258, TPS61259

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SLVSAG8E – SEPTEMBER 2011 – REVISED MARCH 2015

7.4 Thermal Information

TPS6125x

THERMAL METRIC(1)

YFF

UNIT

9 PINS

RθJA

Junction-to-ambient thermal resistance

108.3

RθJC(top)

Junction-to-case (top) thermal resistance

1.0

RθJB

Junction-to-board thermal resistance

°C/W

ψJT

Junction-to-top characterization parameter

4.2

ψJB

Junction-to-board characterization parameter

17.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

7.5 Electrical Characteristics

Minimum and maximum values are at VIN = 2.3V to 5.5V, EN = 1.8V, TA = –40°C to 85°C; Circuit of Parameter Measurement

Information section (unless otherwise noted). Typical values are at VIN = 3.6V, EN = 1.8V, TA = 25°C (unless otherwise

noted).

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY CURRENT

IOUT = 0mA, VIN = 3.6V

µA

Operating quiescent current

EN = VIN, BP = GND

µA

into VIN Operating quiescent current

Device not switching

into VOUT Standby mode quiescent current

IOUT = 0mA, VIN = VOUT = 3.6V

µA

into VIN Standby mode quiescent current

EN = GND, BP = VIN

into VOUT

9.5

µA

Device not switching

ISD

Shutdown current

EN = GND, BP = GND

0.85

5.0

μA

Falling

2.0

2.1

VUVLO

Under-voltage lockout threshold

Hysteresis

0.1

ENABLE, BYPASS

VIL

Low-level input voltage

0.4

VIH

High-level input voltage

1.0

Ilkg

Input leakage current

Input connected to GND or VIN

0.5

µA

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