| Motore di ricerca datesheet componenti elettronici |
|
KAI-2001 Scheda tecnica(PDF) 34 Page - ON Semiconductor |
|
|
|||||||||||||||||||||||||||||
KAI-2001 Scheda tecnica(HTML) 34 Page - ON Semiconductor |
|
34 / 36 page ![]() KAI−2001 www.onsemi.com 34 Die to Package Alignment Figure 37. Die to Package Alignment 1. Center of image is offset from center of package by (0.00, 0.00) mm nominal. 2. Die is aligned within ±2 degree of any package cavity edge. Notes: Dimensions Units: IN [MM] Tolerances: Unless otherwise specified Ceramic ±1% no less than 0.005″ L/F ±1% no more than 0.005″ |
|
Link URL |
| Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |