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Material Content Data Sheet

Sales Product Name

TDA21320

Issued

7. September 2015

MA#

MA001198524

Package

LG-WIQFN-38-2

Weight*

93.67 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

non noble metal

tin

7440-31-5

0.072

0.08

770

noble metal

gold

7440-57-5

0.280

0.30

2987

inorganic material

silicon

7440-21-3

1.911

2.04

2.42

20405

24162

leadframe

non noble metal

iron

7439-89-6

0.058

0.06

616

inorganic material

phosphorus

7723-14-0

0.017

0.02

185

non noble metal

copper

7440-50-8

57.648

61.55

61.63

615451

616252

glue

inorganic material

silicondioxide

60676-86-0

0.031

0.03

336

plastics

maleimide resin

-

0.031

0.03

0.06

336

672

redistribution - layer

noble metal

silver

7440-22-4

0.269

0.29

2875

inorganic material

aluminiumhydroxide

21645-51-2

1.635

1.75

17454

inorganic material

silicondioxide

60676-86-0

2.146

2.29

22908

plastics

epoxy resin

-

2.861

3.05

30544

inorganic material

glass fibre

-

3.576

3.82

38180

non noble metal

tin

7440-31-5

8.663

9.25

92482

non noble metal

copper

7440-50-8

13.371

14.27

34.72

142745

347188

solder resists

organic material

carbon black

1333-86-4

0.011

0.01

117

inorganic material

bariumsulfate

7727-43-7

0.110

0.12

1173

inorganic material

silicondioxide

60676-86-0

0.373

0.40

3987

plastics

acryl epoxy resin

-

0.604

0.64

1.17

6449

11726

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com