1.

2.

3.

Material Content Data Sheet

Sales Product Name

TLF50241EL

Issued

28. August 2013

MA#

MA001056010

Package

PG-SSOP-14-3

Weight*

82.97 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

1.797

2.17

2.17

21665

21665

leadframe

inorganic material

phosphorus

7723-14-0

0.009

0.01

104

non noble metal

zinc

7440-66-6

0.034

0.04

415

non noble metal

iron

7439-89-6

0.689

0.83

8305

non noble metal

copper

7440-50-8

27.978

33.72

34.60

337221

346045

wire

noble metal

gold

7440-57-5

0.152

0.18

0.18

1836

1836

encapsulation

organic material

carbon black

1333-86-4

0.100

0.12

1203

plastics

epoxy resin

-

4.591

5.53

55342

inorganic material

silicondioxide

60676-86-0

45.216

54.50

60.15

545000

601545

leadfinish

non noble metal

tin

7440-31-5

0.976

1.18

1.18

11765

11765

plating

noble metal

silver

7440-22-4

0.768

0.93

0.93

9252

9252

glue

plastics

epoxy resin

-

0.164

0.20

1973

noble metal

silver

7440-22-4

0.491

0.59

0.79

5919

7892

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com