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Material Content Data Sheet

Sales Product Name

TLE6228GP

Issued

28. August 2013

MA#

MA000856434

Package

PG-DSO-20-65

Weight*

2028.22 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

11.949

0.59

0.59

5891

5891

leadframe

inorganic material

phosphorus

7723-14-0

0.359

0.02

177

non noble metal

zinc

7440-66-6

1.435

0.07

707

non noble metal

iron

7439-89-6

28.697

1.41

14149

non noble metal

copper

7440-50-8

1165.200

57.46

58.96

574494

589527

wire

non noble metal

copper

7440-50-8

2.257

0.11

0.11

1113

1113

encapsulation

organic material

carbon black

1333-86-4

1.597

0.08

787

plastics

epoxy resin

-

73.441

3.62

36210

inorganic material

silicondioxide

60676-86-0

723.238

35.66

39.36

356588

393585

leadfinish

non noble metal

tin

7440-31-5

10.336

0.51

0.51

5096

5096

plating

noble metal

silver

7440-22-4

0.686

0.03

0.03

338

338

solder

noble metal

silver

7440-22-4

0.135

0.01

67

non noble metal

tin

7440-31-5

0.090

0.00

44

non noble metal

lead

7439-92-1

8.800

0.43

0.44

4339

4450

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com