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PIC16F72/ML Scheda tecnica(PDF) 89 Page - Microchip Technology |
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PIC16F72/ML Scheda tecnica(HTML) 89 Page - Microchip Technology |
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89 / 136 page ![]() 2002 Microchip Technology Inc. DS39597B-page 87 PIC16F72 14.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Ambient temperature under bias................................................................................................................ -55 to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD, MCLR. and RA4) ......................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ............................................................................................................ -0.3 to +6.5V Voltage on MCLR with respect to VSS (Note 2) ..............................................................................................0 to +13.5V Voltage on RA4 with respect to Vss ...................................................................................................................0 to +12V Total power dissipation (Note 1) ............................................................................................................................... 1.0W Maximum current out of VSS pin ........................................................................................................................... 300 mA Maximum current into VDD pin .............................................................................................................................. 250 mA Input clamp current, IIK (VI < 0 or VI > VDD) ..................................................................................................................... ± 20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ............................................................................................................. ± 20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin .................................................................................................... 25 mA Maximum current sunk by PORTA, PORTB.......................................................................................................... 200 mA Maximum current sourced by PORTA, PORTB .................................................................................................... 200 mA Maximum current sunk by PORTC ....................................................................................................................... 200 mA Maximum current sourced by PORTC .................................................................................................................. 200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL) 2: Voltage spikes at the MCLR pin may cause unpredictable results. A series resistor of greater than 1 k Ω should be used to pull MCLR to VDD, rather than tying the pin directly to VDD. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. |
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