AS1345 – 6

ams Datasheet, Confidential: 2013-Nov [1-51]

Abs o lute M a ximum R a ting s

Stresses beyond those listed in the table below may cause

permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other

conditions beyond those indicated in “Electrical

Characteristics” on page 7 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Figure 6:

Absolute Maximum Ratings

Note: The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC

J-STD-020“Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”.

Parameter

Min

Max

Unit

Comments

Electrical Parameters

VDD, SWIN, SWOUT to GND

-0.3

7

V

LX, FB to GND

-0.3

20

V

Input Current (latch-up

immunity)

-100

100

mA

Norm: JEDEC 78

SWIN to SWOUT Current Limit

1

A

Electrostatic Discharge

Electrostatic Discharge HBM

±2

kV

Norm: MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Junction temperature

+110

ºC

Storage temperature range

-55

+125

ºC

for WL-CSP

-55

+150

ºC

for TDFN

Package thermal

data

WL-CSP

60

ºC/W

Junction-to-ambient thermal resistance is very

dependent on application and board-layout. In

situations where high maximum power

dissipation exists, special attention must be

paid to thermal dissipation during board

design.

TDFN

97

Package body

temperature

WL-CSP

+260

ºC

Norm IPC/JEDEC J-STD-020

TDFN

Norm IPC/JEDEC J-STD-020

Humidity non-condensing

5

85

%

Moisture sensitive level

1

Represents a maximum floor life time of 168h

for TDFN

1

Represents a maximum floor life time of

unlimited for WL-CSP

Absolute Maximum Ratings