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EM3596-RTR Scheda tecnica(PDF) 20 Page - Silicon Laboratories

Il numero della parte EM3596-RTR
Spiegazioni elettronici  High-Performance, Integrated ZigBee
PDF  59 Pages
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Produttore elettronici  SILABS [Silicon Laboratories]
Homepage  http://www.silabs.com
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EM3596-RTR Scheda tecnica(HTML) 20 Page - Silicon Laboratories

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EM359x
20
Rev 1.0
Table 3.6 lists the nRESET pin specifications for the EM359x. The digital I/O power (named VDD_PADS) comes
from three dedicated pins (Pins 27, 35, and 44). The voltage applied to these pins sets the I/O voltage.
3.6. Non-RF System Electrical Characteristics
Table 3.7 lists the non-RF system level characteristics for the EM359x.
Table 3.6. nReset Pin Specifications
Parameter
Test Condition
Min
Typ
Max
Unit
Low Schmitt switching threshold
VSWIL
Schmitt input threshold going from
high to low
0.42 x
VDD_PADS
—
0.50 x
VDD_PADS
V
High Schmitt switching threshold
VSWIH
Schmitt input threshold going from
low to high
0.62 x
VDD_PADS
—
0.80 x
VDD_PADS
V
Input current for logic 1
IIH
—
—
+0.5
μA
Input pull-up resistor value
RIPU
Pull-up value while the chip is not
reset
24
29
34
k
Input pull-up resistor value
RIPURESET
Pull-up value while the chip is
reset
12
14.5
17
k
Table 3.7. Non-RF System Electrical Characteristics
Parameter
Test Condition
Min
Typ
Max
Unit
System wake time from deep
sleep
From wakeup event to first ARM® Cor-
texTM-M3 instruction running from 6 MHz
internal RC clock
Includes supply ramp time and oscillator
startup time
—
110
—
µs
Shutdown time going into deep
sleep
From last ARM® CortexTM-M3 instruction
to deep sleep mode
—
5
—
µs



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